Printed Circuit Board

 

IATF16949 / ISO9001 /ISO14001/ISO13485/GBT29490
Cetified

Automotive PCB

Number of Layers: 3L
Board Thickness: 6.5mm
Minimum Hole Diameter: 1.5mm
Minimum Line Width/Spacing: 2.0mm Inner Layer Copper Thickness: 4.0mm Outer Layer Copper Thickness: 3OZ Surface Finish: Immersion Gold (ENIG) Minimum Distance from Hole to Line: /

Number of Layers: 6L
Board Thickness: 1.6mm
Minimum Hole Diameter: 0.1mm
Minimum Line Width/Spacing: 0.1mm/0.1mmInner Layer Copper Thickness: 18μm
Outer Layer Copper Thickness: 28μm
Surface Finish: Immersion Gold (ENIG)
Minimum Distance from Hole to Line: 0.15mm

 Number of Layers: L2
Board Thickness: 1.6mm
Minimum Hole Diameter: 0.8mm
Minimum Line Width/Spacing: 0.25/0.25mm
Inner Layer Copper Thickness: /
Outer Layer Copper Thickness: Localized 5-10μm
Surface Finish: Gold Plating (ENIG)
Minimum Distance from Hole to Line: /

 Number of Layers: 4L
Board Thickness: 5.0mm
Minimum Hole Diameter: 1.0mm
Minimum Line Width/Spacing: 0.5/0.27mm
Inner Layer Copper Thickness: 3.0mm
Outer Layer Copper Thickness: 1 OZ
Surface Finish: Immersion Gold (ENIG)
Minimum Distance from Hole to Line: Controlled Depth Milling + Bending

Industrial Control PCB

Number of Layers: 36L
Plate thickness: 8.0±0.8mm
Minimum aperture: 0.525mm
Minimum line width/line spacing: 0.0762/0.2388mm
Inner layer copper thickness: 2/1 OZ
Outer layer copper thickness: 53-73μm 
Surface Treatment: Gold Plating ENIG
Minimum distance from hole to line: 0.2mm
Number of Layers: 1L + aluminum base
Plate thickness: 2.0mm
Minimum Hole Diameter:/
Minimum line width/line spacing: 0.3mm
Inner Layer Copper Thickness: /
Outer layer copper thickness: 4OZ         
Surface Treatment: Hot Air Solder Leveling (HASL)                   
Minimum distance from point to line:：/  
Number of Layers: 4L
Plate thickness: 4.0mm
Minimum aperture: 0.65mm
Minimum Line Width/Line Spacing:/
Inner layer copper thickness: 4OZ
Outer layer copper thickness: 4OZ
Surface Treatment: Gold Plating ENIG      
Minimum distance from point to line: / 
 

Number of Layers: 14L
Plate thickness: 2.0±0.2mm
Minimum aperture: 0.275mm
Minimum line width/line spacing 0.1/0.125±20%
Inner Layer Copper Thickness: H/HOZ 1/1OZ 
Outer layer copper thickness: 33-53μm       
Surface Treatment: Immersion Tin
 

Consumer-related-PCB

Number of Layers: 4th to 6th floor
Plate thickness: 0.3-0.4mm
Minimum aperture: 0.075mm
Minimum line width/line spacing: 0.05mm
Inner layer copper thickness: 0.012mm
Outer layer copper thickness 0.025mm 
Surface Treatment: Electroless Nickel Palladium Gold (ENEPIG)  
Minimum distance from hole to line: 0.1mm
Number of Layers:2L
Plate thickness: 0.12mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.05mm
Inner layer copper thickness: 0.012mm
Outer layer copper thickness: 0.02mm
Surface Treatment: Gold Plating ENIG  
Minimum distance from hole to line: 0.1mm  

Number of Layers: 2L
Plate thickness: 0.12mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.05mm
Inner layer copper thickness: 0.012mm
Outer layer copper thickness: 0.02mm
Surface Treatment: Gold Plating ENIG  
Minimum distance from hole to line: 0.1mm

Number of Layers: 8L
Plate thickness: 1.45mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 5/3.6 mil
Inner layer copper thickness: HOZ
Outer layer copper thickness: 1OZ
Surface Treatment: Gold Plating ENIG
Minimum distance from hole to line: 0.25mm

Medical device-PCB

Number of Layers: 12L
Plate thickness: 1.6mm
Minimum Aperture：0.45mm
Minimum line width/line spacing：0.09mm/0.1mm
Inner layer copper thickness:18μm
Outer layer copper thickness：25μm             
Surface treatment： Immersion Gold ENIG  
Minimum distance from point to line：0.18mm  

Number of Layers: 14L
Plate thickness: 2.0mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 0.1mm/0.1mm
Inner layer copper thickness:18μm
外层铜厚：35μm 
Surface treatment： Immersion Gold ENIG  
Minimum distance from hole to line: 0.2mm 
Number of  Layers: 8L
Plate thickness: 0.8mm
Minimum aperture: 0.2mm
Minimum line width/spacing: 3.5/3 mil
Inner Layer Copper Thickness: HOZ
Outer layer copper thickness: 1OZ  
Surface Treatment: Gold Plating ENIG
Minimum distance from hole to line: 0.18mm
Number of Layers: 16L
Plate thickness: 2.0mm
Minimum aperture: 0.2mm
Minimum line width/line spacing: 0.08mm
Inner Layer Copper Thickness: HOZ
Outer layer copper thickness: 1OZ
Surface Treatment: Gold Plating ENIG
Minimum distance from hole to line: 0.16mm 

Communication -PCB

Number of  Layers: 8L
Plate thickness: 1.20mm
Minimum aperture: 0.25mm
Minimum line width/line spacing: 0.081/0.127mm
Inner layer copper thickness: H/H
Outer layer copper thickness: 15-33μm
Surface Treatment: Gold Plating ENIG+OSP
Minimum distance from point to line:/
Number of floors: 6L (1+4BV+1)
Plate thickness: 0.6mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.075mm/0.075mm
Inner layer copper thickness: 18μm
Outer layer copper thickness: 28μm
Surface Treatment: Gold Plating ENIG      
Minimum distance from hole to line: 0.18mm

Number of Layers: 4L
Plate thickness: 1.0mm
Minimum aperture: 0.2mm
Minimum line width/line spacing: 0.127mm
Inner layer copper thickness: 1 oz
Outer layer copper thickness: 1.5OZ         
Surface Treatment: Gold Plating ENIG      
Minimum distance from hole to line: 0.2mm

Number of  Layers: 28L
Plate thickness: 6.5mm
Minimum aperture: 0.7 millimeters
Minimum line width/line spacing: 0.1mm
Inner layer copper thickness: 1 oz
Outer Layer Copper Thickness: TOZ+          
Surface Treatment: Gold Plating ENIG 
Minimum distance from hole to line: 0.18mm  

High-frequency microwave-PCB

Number of Layers:2L
Plate thickness: 0.6mm
Minimum aperture: 0.8mm
Minimum line width/line spacing: 0.12mm
Inner Layer Copper Thickness: /
Outer layer copper thickness: 1OZ
Surface Treatment: Immersion Tin
Minimum distance from point to line:/
Number of layers: 4L + copper base
Plate thickness: 5.6mm
Minimum aperture: 0.35mm
Minimum line width/spacing: 1.25mm
Inner Layer Copper Thickness: HOZ
Outer layer copper thickness: 1OZ        
Surface Treatment: Gold Plating ENIG 
Minimum distance from hole to line: 0.185mm 
Number of Layers: 6
Plate thickness: 3.0mm
Minimum aperture: 0.3mm
Minimum line width/line spacing: 0.25mm
Inner layer copper thickness: 1 oz
Outer layer copper thickness: 1OZ + Plating
Surface Treatment: Gold Plating ENIG           
Minimum distance from hole to line: 0.2mm
Number of Layers: 4L
Plate thickness: 2.0mm
Minimum aperture: 0.3mm
Minimum line width/line spacing: 0.175mm
Inner layer copper thickness: HOZ 
Outer layer copper thickness: 1OZ
Surface Treatment: Gold Plating ENIG      
Minimum distance from hole to line: 0.18mm 

Communication -PCB

Number of Layers: 6
Plate thickness: 1.6mm
Minimum aperture: 0.2mm
Minimum line width/line spacing: 0.075mm/0.075mm
内层铜厚： 35μm
外层铜厚： 35μm            
表面处理： 化金 ENIG   
孔到线最小距离：0.16mm 
层数：10L
Plate thickness: 1.0mm
Minimum aperture: 0.1mm
Minimum line width/line spacing: 0.075mm/0.075mm
内层铜厚： 35μm
外层铜厚： 35μm            
表面处理： 化金+金手指+斜边ENIG+OSP+Beveling of G/F
孔到线最小距离：0.16mm 
层数：4L
板厚：0.3±0.05mm
最小孔径：0.3mm 
最小线宽/线距：0.0508/0.084mm
内层铜厚： H/HOZ
外层铜厚： 17-23μm            
表面处理： 化学镍钯金 ENEPIG
孔到线最小距离： 0.2mm

层数：6L
板厚：0.3±0.05mm
最小孔径：0.6mm 
最小线宽/线距：0.05/0.05mm
内层铜厚： T/TOZ
外层铜厚： 15-33μm            
表面处理： 化金 ENIG
孔到线最小距离： 0.2mm 

层数：8L
板厚：3.2mm
最小孔径：0.4mm
最小线宽/线距：0.25/0.25mm
Inner layer copper thickness: 1 oz
外层铜厚： 2OZ   
表面处理： OSP 
孔到线最小距离： 抗氧化 OSP 

层数：4L
板厚：4.8mm
最小孔径：0.5mm
最小线宽/线距：0.15mm
内层铜厚： LOZ
外层铜厚： LOZ+plating            
Surface Treatment: Gold Plating ENIG 
孔到线最小距离：0.35mm   

层数：6L
板厚：1.1mm
最小孔径：0.3mm
最小线宽/线距：0.15mm
内层铜厚：LOZ
外层铜厚：HOZ+plating  
表面处理：电镀金 Gold Plating 
孔到线最小距离：0.25mm 

层数：8L
板厚：硬板 1.95-2.35mm  FPC0.66±0.06mm
最小孔径：0.6mm
最小线宽/线距：0.122mm
内层铜厚： H/HOZ
外层铜厚： 45-60μm            
表面处理： 喷锡 HASL                     
孔到线最小距离： 0.38mm  

Other Product Solutions

产品：IGBT载板
基材材质：氮化硅
基材厚度：0.32mm
最小线宽/线距：0.50mm/0.50mm
表面处理：OSP
应用领域：高电压、大电流、功率模块、 
                    IGBT
特殊工艺：无空洞钎焊，厚铜精准蚀刻
产品：IGBT载板
基材材质：氧化铝   
基材厚度：0.635mm
最小线宽/线距：0.40mm/0.40mm
表面处理：OSP
应用领域：高电压、大电流、功率模块、
                    IGBT
特殊工艺：厚铜精准蚀刻
产品：功率模块载板
基材材质：99.6%氧化铝
基材厚度：0.5mm
最小线宽/线距：0.10mm/0.10mm
表面处理：正面：Ni/Au≥4μm；背面：Ni/Au≥0.5μm；
应用领域：航空航天、武器装备  
特殊工艺：Φ0.2mm通孔填孔，面铜5±1μm，Rz≤2μm
产品：陶瓷基板（TEC）
基材材质：氧化铝
基材厚度：0.5mm
Minimum Line Width/Line Spacing:/
表面处理：化学镍钯金
应用领域：TEC致冷片
特殊工艺：/
产品：LD热沉（COS）
基材材质：氮化铝
基材厚度：0.34mm
Minimum Line Width/Line Spacing:/
表面处理：电镀镍金
应用领域：LD半导体激光COS封装
特殊工艺：预制金锡共晶
产品：微带环形器
基材材质：铁氧体
基材厚度：0.5mm
最小线宽/线距：0.10mm/0.10mm
表面处理：电镀纯金
应用领域：微带环形器
特殊工艺：多种金属混合溅射，25μm金丝拉力≥9g
产品：微带隔离器
基材材质：铁氧体
基材厚度：0.4mm
最小线宽/线距：0.10mm/0.10mm
表面处理：Cu≥4μm，Au≥2.5μm
应用领域：微带隔离器
特殊工艺：金线路精准蚀刻，TaN隔离电阻，阻值40-50Ω精准控制
产品：薄膜电容
基材材质：氮化铝
基材厚度：0.4mm
最小线宽/线距：0.15±0.005mm/0.07±0.005mm
表面处理：正面：Au≥1.0μm；背面：Au≥0.5μm；
应用领域：电容器
特殊工艺：最小线宽30μm，精准蚀刻厚金